Engilico announces a new evolution of the HyperScope™ system for seal inspection of plastic or cardboard trays, pots and other thermoformed packages.
HyperScope™ uses hyperspectral imaging to detect seal contamination with high contrast, even with printed film.
The inspection system features GPU-accelerated artificial intelligence, which enables high-precision seal area detection in real-time, regardless of the package orientation, packaging material, layout or size.
Another new improvement is the (optionally) integrated conveyor belt that can be completed with an integrated reject unit.
Combining these improvements, HyperScope™ serves as a fully integrated solution for high-accuracy rigid package inspection.